CY7C1049DV33

Document Number: 38-05475 Rev. *G

Page 5 of 14

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter

Description

Test Conditions

36-pin SOJ

Package

44-pin TSOP II

Package

Unit

Thermal Resistance

(Junction to Ambient)

Still Air, soldered on a 3 × 4.5 inch, two layer printed

circuit board

57.91

50.66

C/W

Thermal Resistance

(Junction to Case)

36.73

17.17

C/W

AC Test Loads and Waveforms

Figure 1. AC Test Loads and Waveforms [4]

Data Retention Characteristics

Over the Operating Range

Parameter

Description

Conditions [5]

Min

Max

Unit

2.0

–

V

Data Retention Current

Industrial

–

10

mA

Auto

–

15

mA

Chip Deselect to Data Retention Time

0

–

ns

Operation Recovery Time

–ns

Figure 2. Data Retention Waveform

90%

10%

3.0 V

GND

90%

10%

ALL INPUT PULSES

* CAPACITIVE LOAD CONSISTS

OF ALL COMPONENTS OF THE

TEST ENVIRONMENT

Rise Time: 1 V/ns

Fall Time: 1 V/ns

30 pF*

OUTPUT

Z = 50



50



1.5 V

(b)

(a)

3.3 V

OUTPUT

5 pF

(c)

R 317



R2

351



High Z characteristics:

10 ns device

3.0V

3.0V

DATA RETENTION MODE

CE

Notes

3. Tested initially and after any design or process changes that may affect these parameters.

4. AC characteristics (except High Z) are tested using the load conditions shown in Figure 1 (a). High Z characteristics are tested for all speeds using the test load shown

in Figure 1 (c).

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