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MB89R118C Datasheet(PDF) 45 Page - Fujitsu Component Limited. |
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MB89R118C Datasheet(HTML) 45 Page - Fujitsu Component Limited. |
45 / 48 page MB89R118C DS411-00001-1v0-E 45 ■ SHIPPING METHOD AND RECOMMENDED ASSEMBLY CONDITIONS • Shipping method The following shows shipping method and ordering information for the MB89R118C. Please inquire sepa- rately for the details. • Recommended assembly conditions The MB89R118C is recommended to be mounted in the following condition to maintain the data retention characteristics of the FRAM memory when the chip is mounted. - Mounting temperature of + 175 °C or lower, and 120 minutes or shorter when applied at high temperature, or - Mounting temperature of + 200 °C or lower, and 60 seconds or shorter when applied at high temperature Part no. Input capacitance Wafer thickness Chip dicing Bump Shipped form MB89R118C1-DI15 24 pF 150 μm ± 25.4 μm Completed Au Plating or Au Ball Wafer (with Frame) MB89R118C2-DI15 96 pF +175 +25 120 +200 +25 60 Time [min] Time [s] |
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