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LX5512B Datasheet(PDF) 6 Page - Microsemi Corporation |
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LX5512B Datasheet(HTML) 6 Page - Microsemi Corporation |
6 / 8 page LX5512B PRODUCTION DATA SHEET Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 Copyright © 2004 Rev. 1.0b, 2005-08-18 InGaP HBT 2.4 – 2.5 GHz Power Amplifier TM ® PACKAGE DIMENSIONS LQ 16-Pin MLPQ 3x3 e D E b E2 D2 A A3 A1 L K Pin 1 Indicator or or Or e D E b E2 A A1 L K D2 L1 MILLIMETERS INCHES Dim MIN MAX MIN MAX A 0.80 1.00 0.031 0.039 A1 0 0.05 0 0.002 A3 0.20 REF 0.008 REF b 0.18 0.30 0.007 0.012 D 3.00 BSC 0.118 BSC E 3.00 BSC 0.118 BSC e 0.50 BSC 0.020 BSC D2 1.30 1.55 0.051 0.061 E2 1.30 1.55 0.051 0.061 K 0.2 - 0.008 - L 0.35 0.50 0.012 0.020 L1 - 0.15 - 0.006 Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. 2. Due to multiple qualified assembly sub-contractors either package (with different pin one indicators) may be shipped. Package type will be consistent within the smallest individual container. |
Similar Part No. - LX5512B_05 |
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Similar Description - LX5512B_05 |
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