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LX5510 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX5510
Description  InGaP HBT 2.4 ??2.5 GHz Power Amplifier
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX5510 Datasheet(HTML) 2 Page - Microsemi Corporation

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LX5510
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
© 2000
Rev. 1.0d 2005-08-18
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
TM
®
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ...............................................................................6V
Collector Current ........................................................................................400mA
Total Power Dissipation.................................................................................... 2W
RF Input Power ........................................................................................... 15dBm
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature....................................................................-65°C to +150°C
Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ........ 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
x denotes respective pin designator 1, 2, or 3
TH ERMAL DATA
LQ Plastic MLPQ 16-Pin
THERMAL RESISTANCE
-JUNCTION TO CASE,
θ
JC
10
°C/W
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
50
°C/W
PACKAGE PIN OUT
RF IN
RF IN
RF OUT
RF OUT
VC2
* 1
2
3
4
5
6
7
8
9
1
0
11
12
13 14 15 16
* Pad is Ground
N/C
N/C
N/C
LQ PACKAGE
(Bottom View)
N/C = No connect
RoHS / Pb-free 100% Matte Tin Lead Finish
FUNCTIONAL PIN DESCRIPTION
Name
Description
RF IN
RF input. This pin is DC-shorted to GND but AC-coupled to the transistor base of the first stage.
VB1
Bias current control voltage for the first stage.
VB2
Bias current control voltage for the second stage. The VB2 pin can be connected with the first stage control
voltage (VB1) into a single reference voltage (referred to as Vref) through an external resistor bridge.
VCC
Supply voltage for the bias reference and control circuits. This pin can be combined with both VC1 and VC2 pins,
resulting in a single supply voltage (referred to as Vc).
RF OUT
RF output.
VC1
Power supply for first stage amplifier. The VC1 feedline should be terminated with a 3.3 pF bypass capacitor,
followed by a 8.2 nH blocking inductor at the supply side.
VC2
Power supply for second stage amplifier. The VC2 feedline should be driven with a 8.2 nH AC blocking inductor
and 1 uF bypass capacitor.
GND
The center metal base of the MLP package provides both DC and RF ground as well as heat sink for the power
amplifier.


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