OPA171

OPA2171

OPA4171

SBOS516C

– SEPTEMBER 2010 – REVISED JUNE 2011

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THERMAL INFORMATION: OPA171

OPA171

D (SO)

DBV (SOT23)

DRL (SOT553)

UNITS

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

149.5

245.8

208.1

Junction-to-case(top) thermal resistance

97.9

133.9

0.1

Junction-to-board thermal resistance

87.7

83.6

42.4

°C/W

Junction-to-top characterization parameter

35.5

18.2

0.5

Junction-to-board characterization parameter

89.5

83.1

42.2

Junction-to-case(bottom) thermal resistance

N/A

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2171

OPA2171

D (SO)

DCU (VSSOP)

DGK (MSOP)

UNITS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

134.3

175.2

195.3

Junction-to-case(top) thermal resistance

72.1

74.9

59.4

Junction-to-board thermal resistance

60.6

22.2

115.1

°C/W

Junction-to-top characterization parameter

18.2

1.6

4.7

Junction-to-board characterization parameter

53.8

22.8

114.4

Junction-to-case(bottom) thermal resistance

N/A

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4171

OPA4171

D (SO)

PW (TSSOP)

UNITS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

93.2

106.9

Junction-to-case(top) thermal resistance

51.8

24.4

Junction-to-board thermal resistance

49.4

59.3

°C/W

Junction-to-top characterization parameter

13.5

0.6

Junction-to-board characterization parameter

42.2

54.3

Junction-to-case(bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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