© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 01O

1

Case Outline Number:

485M

TLLGA140 10x10, 0.5P, Dual−Row, Staggered−Pad

CASE 513AL−01

ISSUE O

DATE 20 OCT 2009

C

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.08

A1

A

D2

L

C

0.15

2X

2X

SEATING

C

0.10

C

E2

140X

e

B1

B17

A20

A39

B33

B49

A58

b

140X

A

0.10

B

C

0.05 C

DIM

MIN

MAX

MILLIMETERS

A

0.50

0.60

A1

---

0.05

b

0.25

0.35

D

10.00 BSC

D2

5.70

5.90

E

10.00 BSC

E2

5.70

5.90

e

0.50 BSC

XXXXX = Device Code

A

= Assembly Site

WL

= Wafer Lot

YY

= Year

WW

= Work Week

G

= Pb−Free Package

XXXXXXXXX

XXXXXXXXX

AWLYYWWG

L

0.25

0.35

SCALE 1:1

GENERIC MARKING

DIAGRAM

PIN ONE

LOCATION

PLANE

NOTE 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

DETAIL A

140X

L

A39

B33

140X

b

e

e

e/2

DIMENSION: MILLIMETERS

10.10

0.50

PITCH

40X

0.48

100X

0.35

40X

0.48

0.25

100X

0.35

10.10 5.95

5.95

A1

0.50

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

A1

A76

B64

A

0.15

B

C

A

0.15

B

C

e/2

DETAIL A

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON42332E

ON SEMICONDUCTOR STANDARD

TLLGA140, 10X10, 0.5P

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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