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AD6643 Datasheet(PDF) 10 Page - Analog Devices

Part # AD6643
Description  Dual IF Receiver 1.8 V supply voltages Internal ADC voltage reference
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD6643 Datasheet(HTML) 10 Page - Analog Devices

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AD6643
Rev. 0 | Page 10 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
VIN+A/VIN+B, VIN−A/VIN−B to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
SYNC to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND
−0.3 V to DRVDD + 0.3 V
SCLK to AGND
−0.3 V to DRVDD + 0.3 V
SDIO to AGND
−0.3 V to DRVDD + 0.3 V
OEB to AGND
−0.3 V to DRVDD + 0.3 V
PDWN to AGND
−0.3 V to DRVDD + 0.3 V
OR+/OR− to AGND
−0.3 V to DRVDD + 0.3 V
D0−/D0+ Through D10−/D10+
to AGND
−0.3 V to DRVDD + 0.3 V
DCO+/DCO− to AGND
−0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the printed
circuit board (PCB) increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Typical θJA is specified for a 4-layer PCB that uses a solid ground
plane. As listed in Table 7, airflow increases heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1,2
θJC1,3
θJB1,4
Unit
0
26.8
1.14
10.4
°C/W
1.0
21.6
°C/W
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
2.0
20.2
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
ESD CAUTION


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