MAX16839ASA datasheet(2/11 Pages) MAXIM

Part #	MAX16839ASA

Description	High-Voltage, Linear High-Brightness LED Driver with Open-LED Fault Detect

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Manufacturer	MAXIM [Maxim Integrated Products]

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High-Voltage, Linear High-Brightness LED

Driver with Open-LED Fault Detect

2 ______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

(Voltages are specified with respect to GND.)

IN, SINK.................................................................-0.3V to +45V

FLTS ......................................................................-0.3V to +18V

DIM..........................................................................-0.3V to +6V

CS.........................................................................-0.3V to +0.5V

Continuous Current into SINK and CS.............................120mA

Continuous Power Dissipation (TA = +70NC)

6-Pin TDFN (derate 23.8mW/NC above +70NC) .....1904.8mW

8-Pin SO (derate 18.9mW/NC above +70NC)..........1509.4mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TDFN

Junction-to-Ambient Thermal Resistance (BJA) ..........42NC/W

Junction-to-Case Thermal Resistance (BJC) .....................9NC/W

SO

Junction-to-Ambient Thermal Resistance (BJA) ..........53NC/W

Junction-to-Case Thermal Resistance (BJC) .................5NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VIN = 12V, VFLTS = 0V, RCS = 4.07I, VGND = 0V, DIM = unconnected, CIN = 0.1FF (Note 2), TJ = TA = -40NC to +125NC, unless

otherwise noted. Typical values are at TA = +25NC.) (Note 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

VIN

5

40

V

Quiescent Current

IIN

0.25

0.6

mA

Undervoltage Lockout

VUVLO

VIN rising

3.6

V

UVLO Hysteresis

0.3

V

CS REGULATOR

CS Voltage Accuracy

VCS

TA = +25NC

195.5

203

210.5

mV

-40NC P TA P +125NC, 0.9V P VSINK P 5.5V

(Note 4)

193

213

CS Load Regulation

20mA P ISINK P 100mA

40

F

V/mA

Internal Switch On-Resistance

RDS_ON

(Note 5)

2

4

I

LED CURRENT TRANSIENT RESPONSE

LED Current Turn-On Delay

tDIN

30% of VIN rising edge to 50% of ISINK,

VDIM = 2.1V (Notes 6, 7)

4

9

F

s

LED Current Turn-On Delay

Relative to DIM

tDDIN

VDIM rising edge to 50% of ISINK

2.3

5.5

F

s

LED Current Turn-Off Delay

Relative to DIM

VDIM falling edge to 50% of ISINK

1.3

3.5

F

s

LED Current Rise Time

tr

10% of ISINK to 90% of ISINK

2.5

5.5

F

s

LED Current Fall Time

tf

90% of ISINK to 10% of ISINK

2.5

6

F

s

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