55

Revised: February 22, 2011

© 2011 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to www.littelfuse.com for current information.

-8

-40 -20

0

20 40 60 80 100 120 140 160

-6

-4

0

2

4

6

8

10

12

14

25 °C

25°C

CaseTemperature (T

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

-40

-20

0

20

40

60

80

100 120 140 160

Normalized V

Normalized DC Holding Current vs. Case Temperature

Soldering Parameters

Physical Specifications

Environmental Specifications

Lead Material

Copper Alloy

Terminal Finish

100% Matte-Tin Plated

Body Material

UL recognized epoxy meeting flammability

classification 94V-0

High Temp Voltage

Blocking

80% Rated V

504 or 1008 hrs. MIL-STD-750 (Method 1040)

JEDEC, JESD22-A-101

Temp Cycling

cycles. MIL-STD-750 (Method 1051) EIA/JEDEC,

JESD22-A104

Biased Temp &

Humidity

52 V

DC

JEDEC, JESD22-A-101

High Temp Storage

JEDEC, JESD22-A-101

Low Temp Storage

-65°C, 1008 hrs.

Thermal Shock

10 cycles. MIL-STD-750 (Method 1056) JEDEC,

JESD22-A-106

Resistance to Solder

Heat

Moisture Sensitivity

Level

Reflow Condition

Pb-Free assembly

(see Fig. 1)

Pre Heat

-Temperature Min (T

-Temperature Max (T

-Time (Min to Max) (t

60-180 secs.

Average ramp up rate (LiquidusTemp (T

to peak)

3°C/sec. Max.

T

3°C/sec. Max.

Reflow

-Temperature (T

-Temperature (t

60-150 secs.

PeakTemp (T

Time within 5°C of actual PeakTemp (t

30 secs. Max.

Ramp-down Rate

6°C/sec. Max.

Time 25°C to PeakTemp (T

8 min. Max.

Do not exceed

Time

25

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

Figure 1