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FMS6143 Datasheet(PDF) 3 Page - Fairchild Semiconductor

Part # FMS6143
Description  PCB Layout Considerations for Video Filter / Drivers
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FMS6143 Datasheet(HTML) 3 Page - Fairchild Semiconductor

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AN-6041
APPLICATION NOTE
© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev. 1.0.1 • 12/7/06
3
Printed Circuit Board (PCB) Layers
It is best to use, as a minimum, a four-layer PCB. Assign one inner layer to the dedicated signal ground plane and one inner
layer to the single or split power plane, as shown in Figure 5.
Figure 5.
Recommended PCB Layers
Layout Considerations
General layout and supply bypassing play major roles in
high-frequency performance and thermal characteristics.
Fairchild offers a demonstration board for each product to
guide layout and aid device evaluation. The demo boards
are four-layer boards with full power and ground planes.
Following this layout configuration provides the optimum
performance and thermal characteristics for the device. For
the best results, follow the steps and recommended routing
rules listed below.
Recommended Routing/Layout Rules
Do not run analog and digital signals in parallel.
Use separate analog and digital power planes to supply
power.
Traces should run on top of the ground plane at all times.
No trace should run over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length differences.
Thermal Considerations
Since the interior of most systems, such as set-top boxes,
TVs, and DVD players are at +70ºC; adequate heat sink
must be provided for the device package for heat
dissipation. When designing a system board, determine how
much power each device dissipates. Make sure devices of
high power are not placed in the same location, such as
directly above (top plane) and below (bottom plane) each
other on the PCB.
PCB Thermal Layout Considerations
Understand the system power requirements and
environmental conditions.
Maximize thermal performance of the PCB.
Consider using 70µm of copper for high-power
designs.
Make the PCB as thin as possible by reducing FR4
thickness.
Use vias in power pad to tie adjacent layers together.
Remember that baseline temperature is a function of
board area, not copper thickness.
Modeling techniques can provide a first-order
approximation.


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