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FMS6143 Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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FMS6143 Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 4 page AN-6041 APPLICATION NOTE © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.1 • 12/7/06 3 Printed Circuit Board (PCB) Layers It is best to use, as a minimum, a four-layer PCB. Assign one inner layer to the dedicated signal ground plane and one inner layer to the single or split power plane, as shown in Figure 5. Figure 5. Recommended PCB Layers Layout Considerations General layout and supply bypassing play major roles in high-frequency performance and thermal characteristics. Fairchild offers a demonstration board for each product to guide layout and aid device evaluation. The demo boards are four-layer boards with full power and ground planes. Following this layout configuration provides the optimum performance and thermal characteristics for the device. For the best results, follow the steps and recommended routing rules listed below. Recommended Routing/Layout Rules Do not run analog and digital signals in parallel. Use separate analog and digital power planes to supply power. Traces should run on top of the ground plane at all times. No trace should run over ground/power splits. Avoid routing at 90-degree angles. Minimize clock and video data trace length differences. Thermal Considerations Since the interior of most systems, such as set-top boxes, TVs, and DVD players are at +70ºC; adequate heat sink must be provided for the device package for heat dissipation. When designing a system board, determine how much power each device dissipates. Make sure devices of high power are not placed in the same location, such as directly above (top plane) and below (bottom plane) each other on the PCB. PCB Thermal Layout Considerations Understand the system power requirements and environmental conditions. Maximize thermal performance of the PCB. Consider using 70µm of copper for high-power designs. Make the PCB as thin as possible by reducing FR4 thickness. Use vias in power pad to tie adjacent layers together. Remember that baseline temperature is a function of board area, not copper thickness. Modeling techniques can provide a first-order approximation. |
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