Sheet No.: D1-A02101EN

7

PT4800E0000F

■ Design Notes

1.

This product is not designed to resist electromagnetic and ionized-particle radiation.

■ Manufacturing Guidelines

● Soldering Instructions

1.

Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part are

pre-coated with lead-free solder.

2.

If hand soldering, use temperatures

≤260°C for ≤3 seconds.

3.

When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the

solder, the pad, and the circuit board.

4.

Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

● Cleaning Instructions

1.

Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2.

Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3.

Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4.

Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

■ Presence of ODCs (RoHS Compliance)

This product shall not contain the following materials, and they are not used in the production process for this product:

• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific

brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

• Content information about the six substances specified in “Management Methods for Control of Pollution

Caused by Electronic Information Products Regulation” (Chinese:

)

NOTE:

✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement

as described in SJ/T 11363-2006 standard.

Category

Toxic and Hazdardous Substances

Lead (Pb)

mercury (Hg)

Cadmium (Cd)

Hexavalent

Polybrominated

biphenyls (PBB)

Polybrominated

diphenyl ethers

(PBDE)

Photo Transistor

✓

✓

✓

✓✓✓