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MA4AGSW1_V5 Datasheet(PDF) 7 Page - M/A-COM Technology Solutions, Inc.
MA-COM [M/A-COM Technology Solutions, Inc.]
MA4AGSW1_V5 Datasheet(HTML) 7 Page - M/A-COM Technology Solutions, Inc.
/ 7 page
SPST Reflective AlGaAs PIN Diode Switch
• North America Tel: 800.366.2266 • Europe Tel: +318.104.22.16800
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
These chips should be handled in a clean environment.
These Devices are considered ESD Class 0 HBM. Proper ESD techniques should be used when handling
The protective polymer coating on the active areas of the die provides scratch and impact protection,
particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with
vacuum pickups, or alternatively with plastic tweezers.
The MA4AGSW1, AlGaAs switch is designed to be mounted with electrically conductive silver epoxy or with a
lower temperature solder perform, which does not have a rich tin content.
SOLDER DIE ATTACH
All die attach and bonding methods should be compatible with gold metal. Solder which does not scavenge
gold, such as 80/20, Au/Sn or Indalloy #2 is recommended. Do not expose die to temperatures greater than
300°C for more than 10 seconds.
ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH
Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal
resistance. Cure epoxy per manufacturer
schedule. Typically 150°C for 1 hour.
Thermo-compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.
A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the
lowest inductance and best microwave performance. For more detailed handling and assembly instructions,
see Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” at
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