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ISL24211IRTZ-EVALZ Datasheet(PDF) 2 Page - Intersil Corporation |
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ISL24211IRTZ-EVALZ Datasheet(HTML) 2 Page - Intersil Corporation |
2 / 12 page ISL24211 2 FN7585.0 February 23, 2011 Block Diagram Pin Configuration ISL24211 (10 LD TDFN) TOP VIEW FIGURE 2. BLOCK DIAGRAM OF THE ISL24211 GND I2C INTERFACE DAC REGISTERS 8-Bit EEPROM SCL SDA WP VDD AVDD SET 10 9 3 6 8 7 4 5 CS DVR_OUT 2 1 Q1 A1 VCOM_OUT INN ANALOG DCP AND CURRENT SINK VCOM BUFFER AMPLIFER A2 (*THERMAL PAD CONNECTS TO GND) INN DVR_OUT AVDD 1 2 3 4 10 9 8 7 VCOM_OUT SET SCL SDA EXPOSED THERMAL PAD* 6 VDD GND 5 WP Pin Descriptions PIN NAME PIN NUMBER FUNCTION INN 1 Negative (inverting) input of the VCOM buffer op amp. This pin is used to provide feedback from the end point of the VCOM trace. DVR_OUT 2 Adjustable Sink Current Output Pin. The current sunk into the DVR_OUT pin is equal to the DAC setting times the maximum adjustable sink current divided by 256. See the “SET” pin function description below (pin 9) for the maximum adjustable sink current setting. Also tied to the non-inverting input of buffer amp. AVDD 3 Analog Power Supply Input. Bypass to GND with 0.1µF capacitor. WP 4 EEPROM Write Protect. Active Low. 0 = Programming disabled; 1 = Programming allowed. GND 5 Ground connection. VDD 6 Digital power supply input. Bypass to GND with 0.1µF capacitor. SDA 7 I2C Serial Data Input SCL 8 I2C Clock Input SET 9 Maximum Sink Current Adjustment Point. Connect a resistor from SET to GND to set the maximum adjustable sink current of the DVR_OUT pin. The maximum adjustable sink current is equal to (AVDD/20) divided by RSET. VCOM_OUT 10 Output of the buffer amplifier PAD - Thermal pad should be connected to system ground plane to optimize thermal performance. |
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