CY62256N

Document Number: 001-06511 Rev. *D

Page 5 of 14

Thermal Resistance

Parameter[7]

Description

Test Conditions

DIP

SOIC

TSOP

RTSOP

Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 4.25 × 1.125

inch, 4-layer printed circuit board

75.61

76.56

93.89

93.89

C/W

Thermal resistance

(junction to case)

43.12

36.07

24.64

24.64

C/W

Figure 3. AC Test Loads and Waveforms

Data Retention Characteristics

Parameter

Description

Conditions[8]

Min

Typ[9]

Max

Unit

2.0

–

–

V

Data retention current

LL - Commercial

–0.1

5

A

LL - Industrial/Auto-A

–

0.1

10

A

LL - Auto-E

–

0.1

10

A

Chip deselect to data retention time

0

–

–

ns

Operation recovery time

––

ns

3.0 V

5 V

OUTPUT

R1 1800



R2

990



100 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

<5 ns

<5 ns

5 V

OUTPUT

R1 1800



R2

990



5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

1.77 V

Equivalent to:

THÉVENIN EQUIVALENT

ALL INPUT PULSES

639



Notes

7. Tested initially and after any design or process changes that may affect these parameters.

9. Typical specifications are the mean values measured over a large sample size across normal production process variations and are taken at nominal conditions

Figure 4. Data Retention Waveform

3.0 V

3.0 V

DATA RETENTION MODE

CE

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