Document Number : 38-05329 Rev. *I

Page 5 of 13

Capacitance

Parameter[9]

Description

Test Conditions

Max

Unit

Input capacitance

8pF

Output capacitance

10

pF

Thermal Resistance

Parameter[9]

Description

Test Conditions

VFBGA

Unit

Thermal resistance

(Junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

2-layer printed circuit board

55

°C / W

Thermal resistance

(Junction to case)

16

°C / W

AC Test Loads and Waveforms

Parameters

2.5 V

3.0 V

Unit

R1

16600

1103

Ω

R2

15400

1554

Ω

8000

645

Ω

1.2

1.75

V

Parameter

Description

Conditions

Min

Max

Unit

1.5

–

3.6

V

Data retention current

V

––

10

μA

Chip deselect to data

retention time

0–

–

ns

Operation recovery time

55

–

–

ns

Notes

9. Tested initially and after any design or process changes that may affect these parameters.

OUTPUT

R2

50 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

OUTPUT

Equivalent to:

THEVENIN EQUIVALENT

ALL INPUT PULSES

R1

Fall time: 1 V/ns

Rise Time: 1 V/ns

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