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CY62167DV30LL-55ZXI Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY62167DV30LL-55ZXI
Description  16-Mbit (1M x 16) Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY62167DV30LL-55ZXI Datasheet(HTML) 1 Page - Cypress Semiconductor

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CY62167DV30 MoBL
16-Mbit (1M x 16) Static RAM
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number : 38-05328 Rev. *I
Revised November 8, 2010
Features
Thin small outline package (TSOP I) Configurable as
1M x 16 or as 2M x 8 SRAM
Wide voltage range: 2.2 V – 3.6 V
Ultra-low active power: Typical active current: 2 mA at f = 1
MHz
Ultra-low standby power
Easy memory expansion with CE1, CE2 and OE features
Automatic power-down when deselected
Complementary metal oxide semiconductor (CMOS) for
optimum speed / power
Available in Pb-free and non Pb-free 48-ball very fine ball
grid array (VFBGA) and 48-pin TSOP I package
Functional Description[1]
The CY62167DV30 is a high-performance CMOS static RAM
organized as 1M words by 16 bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life
 (MoBL) in
portable applications such as cellular telephones. The device
also has an automatic power-down feature that significantly
reduces power consumption by 99% when addresses are not
toggling. The device can also be put into standby mode when
deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are
HIGH). The input/output pins (I/O0 through I/O15) are placed
in a high-impedance state when: deselected (CE1 HIGH or
CE2 LOW), outputs are disabled (OE HIGH), both Byte High
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),
or during a Write operation (CE1 LOW, CE2 HIGH and WE
LOW).
Writing to the device is accomplished by taking Chip Enables
(CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW.
If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0
through I/O7), is written into the location specified on the
address pins (A0 through A19). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O8 through I/O15) is written into
the location specified on the address pins (A0 through A19).
Reading from the device is accomplished by taking Chip
Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE)
LOW while forcing the Write Enable (WE) HIGH. If Byte Low
Enable (BLE) is LOW, then data from the memory location
specified by the address pins will appear on I/O0 to I/O7. If Byte
High Enable (BHE) is LOW, then data from memory will appear
on I/O8 to I/O15. See the truth table at the back of this data
sheet for a complete description of Read and Write modes.
Note
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Logic Block Diagram
1M × 16 / 2M x 8
RAM Array
I/O0–I/O7
A 8
A 7
A 6
A 5
A 2
COLUMN DECODER
DATA IN DRIVERS
OE
A 4
A 3
I/O8–I/O15
WE
BLE
BHE
A 0
A 1
A 9
A10
Power-Down
Circuit
BHE
BLE
CE2
CE1
CE2
CE1
BYTE


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