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CY62147EV18 Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY62147EV18
Description  4-Mbit (256K x 16) Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY62147EV18 Datasheet(HTML) 1 Page - Cypress Semiconductor

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Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document #: 38-05441 Rev. *H
Revised October 06, 2010
CY62147EV18 MoBL®
4-Mbit (256K x 16) Static RAM
Features
Very high speed: 55 ns
Wide voltage range: 1.65 V to 2.25 V
Pin compatible with CY62147DV18
Ultra low standby power
Typical standby current: 1 A
Maximum standby current: 7 A
Ultra low active power
Typical active current: 2 mA at f = 1 MHz
Ultra low standby power
Easy memory expansion with CE and OE features
Automatic power down when deselected
Complementary metal oxide semiconductor (CMOS) for
optimum speed and power
Available in a Pb-free 48-ball very fine ball grid array (VFBGA)
package
Functional Description
The CY62147EV18 is a high performance CMOS static RAM
organized as 256 K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL) in portable
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Placing the
device into standby mode reduces power consumption by more
than 99% when deselected (CE HIGH or both BLE and BHE are
HIGH). The input and output pins (I/O0 through I/O15) are placed
in a high impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), both the Byte High
Enable and the Byte Low Enable are disabled (BHE, BLE HIGH),
or during an active write operation (CE LOW and WE LOW).
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW then data
from I/O pins (I/O0 through I/O7) is written into the location
specified on the address pins (A0 through A17). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8 through
I/O15) is written into the location specified on the address pins
(A0 through A17).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appears on I/O0 to I/O7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8 to I/O15. See the “Truth Table” on page 10 for a
complete description of read and write modes.
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
256K x 16
RAM Array
I/O0–I/O7
A8
A7
A6
A5
A2
COLUMN DECODER
DATA IN DRIVERS
OE
A4
A3
I/O8–I/O15
CE
WE
BHE
A0
A1
A9
A10
BLE
BHE
BLE
CE
POWER DOWN
CIRCUIT
Logic Block Diagram
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