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CY7C1313BV18 Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1313BV18
Description  18-Mbit QDR??II SRAM 4-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1313BV18 Datasheet(HTML) 1 Page - Cypress Semiconductor

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18-Mbit QDR™-II SRAM 4-Word
Burst Architecture
CY7C1311BV18, CY7C1911BV18
CY7C1313BV18, CY7C1315BV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 38-05620 Rev. *F
Revised February 02, 2011
18-Mbit QDR™-II SRAM 4-Word Burst Architecture
Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core VDD = 1.8 (±0.1V); IO VDDQ = 1.4V to VDD
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1311BV18 – 2M x 8
CY7C1911BV18 – 2M x 9
CY7C1313BV18 – 1M x 18
CY7C1315BV18 – 512K x 36
Functional Description
The CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and
CY7C1315BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II archi-
tecture has separate data inputs and data outputs to completely
eliminate the need to “turn-around” the data bus required with
common IO devices. Access to each port is accomplished
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR-II read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are provided with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1311BV18), 9-bit words (CY7C1911BV18), 18-bit
words (CY7C1313BV18), or 36-bit words (CY7C1315BV18) that
burst sequentially into or out of the device. Because data can be
transferred into and out of the device on every rising edge of both
input clocks (K and K and C and C), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turn-arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
Maximum Operating Frequency
300
278
250
200
167
MHz
Maximum Operating Current
x8
765
720
665
560
495
mA
x9
800
730
675
570
490
x18
840
760
705
590
505
x36
985
910
830
675
570
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