CY7C1041DV33

Document Number: 38-05473 Rev. *I

Page 5 of 17

Capacitance[7]

Parameter

Description

Test Conditions

Max

Unit

Input capacitance

8

pF

I/O capacitance

8

pF

Thermal Resistance[7]

Parameter

Description

Test Conditions

FBGA

Package

SOJ

Package

TSOP II

Package

Unit

Thermal resistance

(junction to ambient)

Still Air, soldered on a 3 × 4.5 inch,

four layer printed circuit board

27.89

57.91

50.66

°C/W

Thermal resistance

(junction to case)

14.74

36.73

17.17

°C/W

AC Test Loads and Waveforms

The AC test loads and waveform diagram follows.[8]

90%

10%

3.0V

GND

90%

10%

ALL INPUT PULSES

* CAPACITIVE LOAD CONSISTS

OF ALL COMPONENTS OF THE

TEST ENVIRONMENT

Rise Time: 1 V/ns

Fall Time: 1 V/ns

30 pF*

OUTPUT

Z = 50

Ω

50

Ω

1.5V

(b)

(a)

3.3V

OUTPUT

5 pF

(c)

R 317

Ω

R2

351

Ω

High-Z Characteristics

10 ns device

Notes

7. Tested initially and after any design or process changes that may affect these parameters.

8. AC characteristics (except high Z) are tested using the load conditions shown in AC Test Loads and Waveforms (a). High Z characteristics are tested for all speeds

using the test load shown in (c).

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