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CY7C1010DV33 Datasheet(PDF) 3 Page - Cypress Semiconductor |
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CY7C1010DV33 Datasheet(HTML) 3 Page - Cypress Semiconductor |
3 / 12 page CY7C1010DV33 Document Number: 001-00062 Rev. *C Page 3 of 12 Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ................................. –65 C to +150C Ambient Temperature with Power Applied ............................................ –55 C to +125C Supply Voltage on VCC Relative to GND [2]....–0.5V to +4.6V DC Voltage Applied to Outputs in High Z State [2]................................... –0.3V to VCC + 0.3V DC Input Voltage [2] ............................... –0.3V to VCC + 0.3V Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage.................................................>2001V (MIL-STD-883, Method 3015) Latch Up Current ..................................................... >200 mA Operating Range Range Ambient Temperature VCC Industrial –40 C to +85C3.3V 0.3V Electrical Characteristics Over the Operating Range Parameter Description Test Conditions –10 Unit Min Max VOH Output HIGH Voltage VCC = Min.; IOH = –4.0 mA 2.4 V VOL Output LOW Voltage VCC = Min.; IOL = 8.0 mA 0.4 V VIH Input HIGH Voltage 2.0 VCC + 0.3 V VIL Input LOW Voltage[2] –0.3 0.8 V IIX Input Leakage Current GND < VI < VCC –1 +1 A IOZ Output Leakage Current GND < VOUT < VCC, Output Disabled –1 +1 A ICC VCC Operating Supply Current VCC = Max., f = fMAX = 1/tRC 100 MHz 90 mA 83 MHz 80 66 MHz 70 40 MHz 60 ISB1 Automatic CE Power-down Current —TTL Inputs Max. VCC, CE > VIH; VIN > VIH or VIN < VIL, f = fMAX 20 mA ISB2 Automatic CE Power-down Current —CMOS Inputs Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 10 mA Capacitance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Test Conditions SOJ TSOP II Unit CIN Input Capacitance TA = 25C, f = 1 MHz, VCC = 3.3V 8 8 pF COUT IO Capacitance 8 8 pF Thermal Resistance Tested initially and after any design or process changes that may affect these parameters. Parameter Description Test Conditions SOJ TSOP II Unit JA Thermal Resistance (Junction to Ambient) Still air, soldered on a 3 × 4.5 inch, four layer printed circuit board 59.17 50.66 C/W JC Thermal Resistance (Junction to Case) 32.63 17.77 C/W Note 2. VIL (min.) = –2.0V and VIH (max.) = VCC + 2.0V for pulse durations of less than 20 ns. [+] Feedback |
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