ISL78302

3

FN7696.0

January 28, 2011

Pin Descriptions

PIN

NUMBER

PIN

NAME

TYPE

DESCRIPTION

1

VIN

Analog I/O

Supply Voltage/LDO Input. Connect a 1µF capacitor to GND.

2

EN1

Low Voltage Compatible CMOS Input

LDO-1 Enable. ENABLE = HIGH

3

EN2

Low Voltage Compatible CMOS Input

LDO-2 Enable. ENABLE = HIGH

4

CBYP

Analog I/O

Reference Bypass Capacitor Pin. Recommended to connect capacitor of value

0.01µF between this pin and GND for optimum noise and PSRR performance.

5

CPOR

Analog I/O

POR2 Delay Setting Capacitor Pin. Connect a capacitor between this pin and

GND to delay the POR2 output release after LDO-2 output reaches 94% of its

specified voltage level. (200ms delay per 0.01µF).

6

GND

Ground

GND is the connection to system ground. Connect to PCB Ground plane.

7POR1

Open Drain Output (1mA)

Open-drain POR Output for LDO-1 (active-low). Internally connected to VO1

through 100k

Ω resistor.

8POR2

Open Drain Output (1mA)

Open-drain POR Output for LDO-2 (active-low). Internally connected to VO2

through 100k

Ω resistor.

9VO2

Analog I/O

LDO-2 Output. Connect capacitor of value 1µF to 10µF to GND (1µF

recommended).

10

VO1

Analog I/O

LDO-1 Output. Connect capacitor of value 1µF to 10µF to GND (1µF

recommended).

Ordering Information

PART NUMBER

(Notes 1, 3, 4)

PART

MARKING

VO1 VOLTAGE

(V) (Note 2)

VO2 VOLTAGE

(V) (Note 2)

TEMP RANGE

(°C)

PACKAGE

(Pb-Free)

PKG

DWG. #

ISL78302ARFBZ

DNAB

2.5

1.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARBFZ

DNAC

1.5

2.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARNBZ

DNAD

3.3

1.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARBNZ

DNAE

1.5

3.3

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARNWZ

DNAF

3.3

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARWCZ

DNAG

1.2

1.8

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARFWZ

DNAH

2.5

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

Coming Soon

ISL78302ARCWZ

DANJ

1.8

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

NOTES:

1. Add “-T*”suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. For other output voltages, contact Intersil.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see device information page for ISL78302. For more information on MSL please see techbrief TB363.