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SY89833LMG Datasheet(PDF) 3 Page - Micrel Semiconductor

Part # SY89833LMG
Description  3.3V ULTRA-PRECISION 1:4 LVDS FANOUT BUFFER/TRANSLATOR WITH INTERNAL TERMINATION
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

SY89833LMG Datasheet(HTML) 3 Page - Micrel Semiconductor

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3
Precision Edge®
SY89833L
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
August 2007
Absolute Maximum Ratings(1)
Supply Voltage (V
CC) .................................. –0.5V to +4.0V
Input Voltage (V
IN) ............................... –0.5V to VCC +0.3V
LVDS Output Current (I
OUT) ..................................... ±10mA
Input Current
Source or Sink Current on (IN, /IN) .................. ±50mA
V
REF-AC Current
Source or Sink Current on (I
VT) .......................... ±2mA
Maximum Operating Junction Temperature .............. 125°C
Lead Temperature (Soldering, 20 sec.) ..................... 260°C
Storage Temperature (T
S) ....................... –65°C to +150°C
Operating Ratings(2)
Supply Voltage Range .............................. +3.0V to +3.60V
Ambient Temperature (T
A) ......................... –40°C to +85°C
Package Thermal Resistance(3)
MLF® JA)
Still-Air ............................................................. 60°C/W
MLF® JB) .......................................................... 33°C/W
T
A = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply Voltage Range
3.0
3.3
3.6
V
I
CC
Power Supply Current
No load, max. V
CC.75
100
mA
R
IN
Input Resistance (IN-to-VT)
45
50
55
R
DIFF-IN
Differential Input Resistance
90
100
110
(IN-to-/IN)
V
IH
Input HIGH Voltage
0.1
V
CC+0.3
V
(IN, /IN)
V
IL
Input LOW Voltage
–0.3
V
IH – 0.1
V
(IN, /IN)
V
IN
Input Voltage Swing
Note 3, see Figure 2c.
0.1
V
CC
V
(IN, /IN)
V
DIFF_IN
Differential Input Voltage
Note 3, see Figure 2d.
0.2
V
|IIN|
Input Current
45
mA
IN, /IN
V
REF–AC
Reference Voltage
Note 5
V
CC–1.525 VCC–1.425 VCC–1.325
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψ
JB and θJA values
are determined for a 4-layer board in still-air number, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. Due to the internal termination (see "Input Buffer Structure" section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do
not apply a combination of voltages that causes the input current to exceed the maximum limit!
DC ELECTRICAL CHARACTERISTICS(4)


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