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SY89543LMG Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY89543LMG Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 10 page 3 Precision Edge® SY89543L Micrel, Inc. M9999-041608 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Supply Voltage (VCC) ................................. –0.5V to +4.0V Input Voltage (VIN) ........................................ –0.5V to VCC Termination Current(3) Source or sink current on VT ..................................... ±100mA Input Current Source or sink current on IN, /IN .......................... ±50mA Lead Temperature (soldering, 20 sec.) ................... +260 °C Storage Temperature (TS) ....................... -65°C to +150°C Operating Ratings(2) Supply Voltage (VCC) ..................................... 3.0V to 3.6V Ambient Temperature (TA) ........................ –40°C to +85°C Package Thermal Resistance(4) MLF® ( θ JA) Still-Air ................................................................ 35 °C/W 500lfpm .............................................................. 28 °C/W MLF® ( ψ JB) Junction-to-Board ............................................... 20 °C/W TA = –40°C to +85°C; Unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VCC Power Supply 3.0 3.3 3.6 V ICC Power Supply Current No Load, Max. VCC (6) 66 88 mA RDIFF_IN Differential Input Resistance 80 100 120 Ω (IN-to-/IN) RIN Input Resistance 40 50 60 Ω (IN-to-VT, /IN-to-VT) VIH Input High Voltage (IN, /IN) 1.2 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH–0.1 V VIN Input Voltage Swing (IN, /IN) Notes 7 0.1 VCC V VDIFF_IN Differential Input Voltage Swing Notes 7 0.2 V |IN - /IN| IN-to-VT Voltage from Input to VT 1.8 V Notes: 1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. Ψ JB uses 4-layer θ JA in still air unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. Includes current through internal 50 Ω pull-ups. 7. See “Operating Characteristics” section for VIN and VDIFF_IN definition. DC ELECTRICAL CHARACTERISTICS(5) |
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