Micrel, Inc.

SY89468U

November 2008

M9999-110308-D

4

Source or sink on VT pin .......................... ±100mA

Input Current

Source or sink current on (IN, /IN) ............. ±50mA

(4)

............. ±0.5mA

Maximum operating Junction Temperature….. 125°C

Lead Temperature (soldering, 20 sec.)............ +260°C

Package Thermal Resistance

(3)

TQFP (

Still-Air ........................................................ 35°C/W

TQFP (

Junction-to-Board ...................................... 21°C/W

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

2.375

2.5

2.625

V

Power Supply Current

260

365

mA

Input Resistance

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input High Voltage

(IN, /IN)

0.1

V

Input Low Voltage

(IN, /IN)

0

V

Input Voltage Swing

(IN, /IN)

See Figure 2a. Note 6.

0.1

1.0

V

Differential Input Voltage Swing

|IN-/IN|

See Figure 2b.

0.2

V

Input Voltage Threshold that

Triggers FSI

30

100

mV

Output Reference Voltage

V

1.28

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

4. Due to limited drive capability use for input of the same package only.

5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.