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SY89468UHY Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SY89468UHY Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 15 page Micrel, Inc. SY89468U November 2008 M9999-110308-D hbwhelp@micrel.com or (408) 955-1690 4 Absolute Maximum Ratings(1) Supply Voltage (VCC) ............................ –0.5V to +4.0V Input Voltage (VIN) ....................................–0.5V to VCC LVDS Output Current (IOUT)…………………….±10mA Current (VT) Source or sink on VT pin .......................... ±100mA Input Current Source or sink current on (IN, /IN) ............. ±50mA Current (VREF) Source/Sink Current on VREF-AC (4) ............. ±0.5mA Maximum operating Junction Temperature….. 125°C Lead Temperature (soldering, 20 sec.)............ +260°C Storage Temperature (Ts) ...................–65°C to 150°C Operating Ratings(2) Supply Voltage (VCC) ....................+2.375V to +2.625V Ambient Temperature (TA)……………-40°C to +85°C Package Thermal Resistance (3) TQFP ( q JA) Still-Air ........................................................ 35°C/W TQFP ( y JB) Junction-to-Board ...................................... 21°C/W DC Electrical Characteristics(5) TA = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VCC Power Supply 2.375 2.5 2.625 V ICC Power Supply Current No load, max VCC 260 365 mA RIN Input Resistance (IN-to-VT) 45 50 55 Ω RDIFF_IN Differential Input Resistance (IN-to-/IN) 90 100 110 Ω VIH Input High Voltage (IN, /IN) 0.1 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH–0.1 V VIN Input Voltage Swing (IN, /IN) See Figure 2a. Note 6. 0.1 1.0 V VDIFF_IN Differential Input Voltage Swing |IN-/IN| See Figure 2b. 0.2 V VIN_FSI Input Voltage Threshold that Triggers FSI 30 100 mV VREF-AC Output Reference Voltage IVREF-AC = + 0.5mA VCC–1.3 VCC–1.2 VCC–1.1 V VT_IN Voltage from Input to VT 1.28 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. qJA and yJB values are determined for a 4-layer board in still air unless otherwise stated. 4. Due to limited drive capability use for input of the same package only. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIN (max) is specified when VT is floating. |
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