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SY58031UMITR Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY58031UMITR Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 9 page 3 Precision Edge® SY58031U Micrel, Inc. M9999-073010 hbwhelp@micrel.com or (408) 955-1690 AbsoluteMaximumRatings(1) Power Supply Voltage (VCC ) .......................–0.5V to +4.0V Input Voltage (VIN)...........................................–0.5V to VCC Current (VT) Source or sink current on VT pin......................... ±100mA Input Current (VT) Source or sink current on IN, /IN .......................... ±50mA Current (VREF) Source or sink current on VREF-AC(3)................... ±1.5mA Lead Temperature Soldering, (20 sec.) ..................... 260°C Storage Temperature Range (TS )............ –65°C to +150°C Operating Ratings(2) Power Supply Voltage (VCC) ................. +2.375V to +3.60V Ambient Temperature Range (TA) .............. –40°C to +85°C Package Thermal Resistance(4) MLF® (θJA) Still-Air ............................................................. 35°C/W MLF® (ψJB) Junction-to-Board ............................................ 20°C/W Symbol Parameter Condition Min Typ Max Units VCC Power Supply Voltage 2.5V nominal 2.375 2.5 2.625 V 3.3V nominal 3.0 3.3 3.6 V ICC Power Supply Current VCC = max. no lead. Includes current 265 330 mA through 50Ω pull-ups. VIH Input HIGH Voltage IN1, /IN1, Note 6 VCC–1.6 VCC V VIL Input LOW Voltage IN1, /IN1 0 VIH–0.1 V VIN Input Voltage Swing IN1, /IN1, see Figure 1a. 0.1 1.7 V VDIFF_IN Differential Input Voltage Swing IN1, /IN1, see Figure 1b. 0.2 V |IN0, /IN0|, |IN1, /IN1| RIN In-to-VT Resistance 40 50 60 Ω VT IN Max. In-to-VT (IN, /IN) 1.28 V VREF-AC VCC–1.3 VCC–1.2 VCC–1.1 V DCELECTRICALCHARACTERISTICS(5) TA= –40°C to +85°C VCC = 2.5V ±5% or 3.3V ±10%; RL = 100Ω across Q and /Q; TA= –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VOH Output HIGH Voltage VCC–0.020 VCC V VOUT Output Voltage Swing see Figure 1a. 325 400 mV VDIFF_OUT Differential Voltage Swing see Figure 1b. 650 800 mV ROUT Output Source Impedance 40 50 60 Ω Notes: 1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratingsconditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. ψJB uses 4-layer θJA in still-air number unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above tables after thermal equilibrium has been established. 6. VIH (min) not lower tha 1.2V. CMLDCELECTRICALCHARACTERISTICS(5) |
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