ADM1166 datasheet(32/32 Pages) AD

Part #	ADM1166

Description	Super Sequencer with Margining Control and Nonvolatile Fault Recording

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Manufacturer	AD [Analog Devices]

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ADM1166

Rev. 0 | Page 32 of 32

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FORPROPERCONNECTIONOF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

*4.70

4.60 SQ

4.50

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

40

1

11

20

21

30

31

10

Figure 48. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-7)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-026ABC

0.50

BSC

LEAD PITCH

0.27

0.22

0.17

9.00

BSC SQ

7.00

BSC SQ

1.20

MAX

TOP VIEW

(PINS DOWN)

1

12

13

25

24

36

37

48

0.75

0.60

0.45

PIN 1

VIEW A

1.05

1.00

0.95

0.20

0.09

0.08 MAX

COPLANARITY

SEATING

PLANE

0° MIN

7°

3.5°

0°

0.15

0.05

VIEW A

ROTATED 90° CCW

Figure 49. 48-Lead Thin Plastic Quad Flat Package [TQFP]

(SU-48)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADM1166ACPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-40-7

ADM1166ACPZ-REEL

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-40-7

ADM1166ASUZ

−40°C to +85°C

48-Lead Thin Plastic Quad Flat Package [TQFP]

SU-48

ADM1166ASUZ-REEL

−40°C to +85°C

48-Lead Thin Plastic Quad Flat Package [TQFP]

SU-48

EVAL-ADM1166TQEBZ

Evaluation Kit [TQFP]

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D09332-0-1

2/10(0)

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