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PCF8576D Datasheet(PDF) 42 Page - NXP Semiconductors

Part No. PCF8576D
Description  Universal LCD driver for low multiplex rates
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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PCF8576D Datasheet(HTML) 42 Page - NXP Semiconductors

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PCF8576D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 14 February 2011
42 of 50
NXP Semiconductors
PCF8576D
Universal LCD driver for low multiplex rates
17.2 Carrier tape information
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Fig 29. Tape details
Table 24.
Carrier tape dimensions
Symbol
Description
Value
Unit
A0
pocket width in x direction
8.6
mm
B0
pocket width in y direction
14.5
mm
K0
pocket height
1.8
mm
P1
sprocket hole pitch
12
mm
W
tape width in y direction
24
mm
001aaj314
direction of feed
K0
4A0
P1
B0
W
pin 1 index


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