 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
LPC1225FBD48321 Datasheet(PDF) 30 Page - NXP Semiconductors |
|
||||||||||||||||||||||||||||||
LPC1225FBD48321 Datasheet(HTML) 30 Page - NXP Semiconductors |
|
|
30 / 60 page 
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 21 February 2011 30 of 60 NXP Semiconductors LPC122x 32-bit ARM Cortex-M0 microcontroller 9. Thermal characteristics 9.1 Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. T j T amb P D R th j a – + = Table 6. Thermal characteristics VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient JEDEC test board; no air flow LQFP64 package - 61 - C/W LQFP48 package 86 - C/W Rth(j-c) thermal resistance from junction to case JEDEC test board LQFP64 package - 19 - C/W LQFP48 package 36 - C/W Tj(max) maximum junction temperature --150 C |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
