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MF1SPLUS8001DUD03 Datasheet(PDF) 11 Page - NXP Semiconductors

Part # MF1SPLUS8001DUD03
Description  Mainstream contactless smart card IC for fast and easy solution development
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MF1SPLUS8001DUD03 Datasheet(HTML) 11 Page - NXP Semiconductors

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MF1SPLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
187032
11 of 17
NXP Semiconductors
MF1SPLUSx0y1
Mainstream contactless smart card IC
9.5 Security level 3 command overview
10. Limiting values
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device.
[2]
Exposure to limiting values for extended periods may affect device reliability.
[3]
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k
Ω.
Command set for security level switch and originality function using ISO/IEC 14443-4
protocol
First Authenticate (part 1)
first authenticate
Following Authenticate (part 1)
following authenticate
Authenticate (part 2)
second authentication step
Table 7.
Security level 1 command overview …continued
MF1ICS50, MF1ICS70,
MF1ICS20 commands
Description
Table 8.
Security level 3 command overview
Command
Description
MIFARE Plus commands
First Authenticate (part 1)
first authenticate
Following Authenticate (part 1) following authenticate
Authenticate (part 2)
second authentication step
ResetAuth
reset the authentication step
READ commands
Read Plain MACed
reading in plain, MAC on response, MAC on command
WRITE commands
Write MACed
writing encrypted, MAC on response, MAC on command
Write Plain MACed
writing in plain, MAC on response, MAC on command
Virtual card concept
Virtual Card Support Last
check if the virtual card concept is supported, communicate PCD
capabilities and retrieve the UID
Deselect Virtual Card
deselect the virtual card
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max[1][2] Unit
II
input current
-
30
mA
Ptot/pack total power dissipation per package
-
200
mW
Tstg
storage temperature
−55
125
°C
Tamb
ambient temperature
−25
70
°C
VESD
electrostatic discharge voltage
[3]
2-
kV
Ilu
latch-up current
±100
-
mA


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