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SB820FCT Datasheet(PDF) 1 Page - Pan Jit International Inc. |
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SB820FCT Datasheet(HTML) 1 Page - Pan Jit International Inc. |
1 / 2 page PAGE . 1 STAD-APR.27.2009 SB820FCT~SB860FCT FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O utilizing Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, high current capability • High surge capacity. • For use in low voltage,high frequency inverters free wheeling , and polarlity protection applications. • In compliance with EU RoHS 2002/95/EC directives D2PAK SURFACE MOUNTSCHOTTKY BARRIER RECTIFIER .027(.67) .022(.57) VOLTAGE 20 to 60 Volts CURRENT 8 Ampere MECHANICALDATA • Case: ITO-220AB full molded plastic package • Terminals: Lead solderable per MIL-STD-750, Method 2026 • Polarity: As marked. • Mounting Position: Any • Weight: 0.055 ounces, 1.5615 grams. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% R E T E M A R A PL O B M Y S T C F 0 2 8 B ST C F 0 3 8 B ST C F 0 4 8 B ST C F 0 5 8 B ST C F 0 6 8 B S S T I N U e g a t l o V e s r e v e R k a e P t n e r r u c e R m u m i x a MV M R R 0 20 30 40 50 6V e g a t l o V S M R m u m i x a MV S M R 4 11 28 25 32 4V e g a t l o V g n i k c o l B C D m u m i x a MV C D 0 20 30 40 50 6V T t a t n e r r u C d r a w r o F e g a r e v A m u m i x a Mc 5 7 = O CI ( F) V A 8A - e n i s f l a h e l g n i s s m 3 . 8 : t n e r r u C e g r u S d r a w r o F k a e P ) d o h t e m C E D E J ( d a o l d e t a r n o d e s o p m i r e p u s e v a w I M S F 0 5 1A A 0 . 4 t a e g a t l o V d r a w r o F m u m i x a MV F 5 5 . 05 7 . 0V T t n e r r u C e s r e v e R C D m u m i x a M J 5 2 = O C T e g a t l o V g n i k c o l B C D d e t a R t a J 0 0 1 = O C I R 2 . 0 0 5 1 . 0 0 5 A m c n a t s i s e R l a m r e h T l a c i p y Te Rθ C J 3 O W / C e g n a R e r u t a r e p m e T n o i t c n u J g n i t a r e p OTJ 5 2 1 + o t 5 5 -0 5 1 + o t 5 5 - O C e g n a R e r u t a r e p m e T e g a r o t STSTG 0 5 1 + o t 5 5 - O C NOTES: Both Bonding and Chip structure are available. |
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