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TCA9406 Datasheet(PDF) 2 Page - Texas Instruments

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Part No. TCA9406
Description  2-BIT BIDIRECTIONAL 1MHz, I2C BUS AND SMBUS VOLTAGE-LEVEL TRANSLATOR
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

TCA9406 Datasheet(HTML) 2 Page - Texas Instruments

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TCA9406
SCPS221 – JULY 2010
www.ti.com
With the standard I2C bus system, it needs pull-up resistors to provide logic HIGH levels on the translator
bus. The TCA9406 is an open-drain bus level configuration of the I2C-bus. The value of pullup resistors
depends on the system, but each side of the translator must have pull-up resistors and TCA9406 already has
10 k
Ω pullup resistors on each side and it allows to add additional external pull-up resistors. It can work with
standard-mode, fast-mode and fast mode plus I2C-bus devices in additional to SMBus.
The TCA9406 is not a bus buffer like the PCA9515A and PCA9517. It provides both level translation and
physically isolates the capacitance to either side of the bus when both sides are connected. The Ioff feature
can be utilized to isolate the bus into high impedance when using the power supply to off the either VCCA or
VCCB.
The Enable (OE) should be tied to GND through a pulldown resistor to ensure the high-impedance state
during power up or power down. The minimum value of the resistor is determined by the current-sourcing
capability of the driver.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
TCA9406YZPR
0.23-mm Large Bump – YZP
Reel of 3000
TCA9406DCTR
–40°C to 85°C
SSOP – DCT
Tube of 250
TCA9406DCTT
VSSOP – DCU
Reel of 3000
TCA9406DCUR
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DCT: The actual top-side marking has three additional characters that designate the year, month, and wafer fab/assembly site.
DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO.
NAME
TYPE
FUNCTION
DCT,
YZP
DCU
1
A1
SDA_B
I/O
Input/output B. Referenced to VCCB. Allow I2C_SDA configured to 2.5V/3.3V/5V
2
B1
GND
GND
Ground
A-port supply voltage. 1.65 V
≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB. Configuration for
3
C1
VCCA
PWR
SDA_A, SCL_A, and OE
4
D1
SDA_A
I/O
Input/output A. Referenced to VCCA. Allows I2C_SDA configured to 1.8V, 2.5V, 3.3V
5
D2
SCL_A
I/O
Input/output A. Referenced to VCCA. Allows I2C_SCL configured to 1.8V, 2.5V, 3.3V
Output enable (active High). Pull OE low to place all outputs in 3-state mode.
6
C2
OE
Input
Referenced to VCCA. Pull OE to LOW to place all outputs in 3-state mode with 3.6V
input tolerance.
7
B2
VCCB
PWR
B-port supply voltage. 2.3 V
≤ VCCB ≤ 5.5 V for SDA_B, SCL_B
8
A2
SCL_B
I/O
Input/output B. Referenced to VCCB. Allow I2C_SCL configured to 2.5V/3.3V/5V
2
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TCA9406


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