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DCX143TU Datasheet(PDF) 1 Page - Diodes Incorporated |
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DCX143TU Datasheet(HTML) 1 Page - Diodes Incorporated |
1 / 12 page DCX (xxxx) U SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR Features • Epitaxial Planar Die Construction • Built-In Biasing Resistors • Surface Mount Package Suited for Automated Assembly • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Note 4 and 5) Mechanical Data • Case: SOT-363 • Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • Terminal Connections: See Diagram • Marking Information: See Page 11 • Ordering Information: See Page 11 • Weight: 0.006 grams (approximate) P/N R1 R2 MARKING DCX124EU 22K Ω 22K Ω C17 DCX144EU 47K Ω 47K Ω C20 DCX114YU 10K Ω 47K Ω C14 DCX123JU 2.2K Ω 47K Ω C06 DCX114EU 10K Ω 10K Ω C13 DCX143TU 4.7K Ω - C07 DCX143EU 4.7K Ω 4.7KΩ C08 DCX114TU 10K Ω - C12 SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 H 1.80 2.20 J ⎯ 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 α 0 ° 8° All Dimensions in mm A M J L D B C H K F CXX YM R1, R2 R1 Only SCHEMATIC DIAGRAM Q1: NPN Transistor Q2: PNP Transistor R 1 R 1 BQ2 BQ1 CQ1 CQ2 1 2 3 4 5 6 EQ2 EQ1 R 2 R2 Q2 Q1 R 1 R 1 CQ1 Q1 Q2 1 2 3 4 5 6 BQ2 BQ1 CQ2 EQ2 EQ1 Maximum Ratings NPN Section @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Supply Voltage, (6) to (1) VCC 50 V Input Voltage, (2) to (1) DCX124EU DCX144EU DCX114YU DCX123JU DCX114EU DCX143TU DCX143EU DCX114TU VIN -10 to +40 -10 to +40 -6 to +40 -5 to +12 -10 to +40 -5V max -10 to +30 -5V max V Output Current DCX124EU DCX144EU DCX114YU DCX123JU DCX114EU DCX143TU DCX143EU DCX114TU IO 30 30 70 100 50 100 100 100 mA Output Current All IC (Max) 100 mA Power Dissipation (Total) (Note 2) PD 200 mW Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 625 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: 1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf. 2. 150mW per element must not be exceeded. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. DS30347 Rev. 11 - 2 1 of 12 www.diodes.com DCX (xxxx) U © Diodes Incorporated Please click here to visit our online spice models database. |
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