21

8535F–SEEPR–6/10

Atmel AT25320B/640B

8A2 – TSSOP

Package Drawing Contact:

packagedrawings@atmel.com

DRAWING NO.

REV.

TITLE

GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D

2.90

3.00

3.10

2, 5

E

6.40 BSC

E1

4.30

4.40

4.50

3, 5

A

–

–

1.20

A2

0.80

1.00

1.05

b

0.19

–

0.30

4

e

0.65 BSC

L

0.45

0.60

0.75

L1

1.00 REF

Side View

End View

Top View

A2

A

L

L1

D

1

2

3

E1

N

b

Pin 1 indicator

this corner

E

e

Notes:

1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,

tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall

not exceed 0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed

0.25 mm (0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess

of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.

Minimum space between protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

8A2

E

5/19/10

8A2, 8-lead 4.4mm Body, Plastic Thin

Shrink Small Outline Package (TSSOP)

TNR