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BZT52C18S Datasheet(PDF) 1 Page - Diodes Incorporated

Part No. BZT52C18S
Description  SURFACE MOUNT ZENER DIODE
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Maker  DIODES [Diodes Incorporated]
Homepage  http://www.diodes.com
Logo DIODES - Diodes Incorporated

BZT52C18S Datasheet(HTML) 1 Page - Diodes Incorporated

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BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
Ultra-Small Surface Mount Package
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOD-323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.0049 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Forward Voltage (Note 2)
@ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RθJA
625
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 16 - 2
1 of 4
www.diodes.com
June 2008
© Diodes Incorporated
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