Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

32

1

PIN 1

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

D

BE

C

JJ

N

N

H

E

K

K

F

DIMENSIONS:

MM

(INCHES)

Dim.

Min.

Typ.

Max.

A

3.90

(.154)

4.00

(.157)

4.10

(.161)

B

8.15

(.321)

8.25

(.325)

8.35

(.329)

C

0.80

(.031)

0.85

(.033)

0.90

(.035)

D

0.000

(.000)

0.025

(.001)

0.050

(.002)

E

2.55

(.100)

2.60

(.102)

2.65

(.104)

F

1.10

(.043)

1.15

(.045)

1.20

(.047)

H

3.45

(.136)

3.50

(.138)

3.55

(.140)

J

0.20

(.008)

0.25

(.010)

0.30

(.012)

K

0.65

(.026)

0.70

(.028)

0.75

(.030)

N

0.20

(.008)

0.25

(.010)

0.30

(.012)

Recommended Pad Layout

3.55

(.140)

0.70

(.028)

1.15

(.045)

2.625

(.103)

Pad #

Apply

1

In/Out

2NC

3

In/Out

NC = Solder to PCB; do not make electrical

connection, do not connect to ground.

Pad Designation

TBU™ protectors have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil

thickness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking

any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not

allow any signal, ground or power signals beneath any of the pads of the device.

Thermal Resistances

Symbol

Parameter

Value

Unit

Junction to leads (package)

116

°C/W

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.