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NP82N04NDG Datasheet(PDF) 9 Page - Renesas Technology Corp |
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NP82N04NDG Datasheet(HTML) 9 Page - Renesas Technology Corp |
9 / 10 page Data Sheet D19800EJ1V0DS 7 NP82N04MDG, NP82N04NDG MARKING INFORMATION 82N04 Lot code NEC DG Pb-free plating marking Abbreviation of part number RECOMMENDED SOLDERING CONDITIONS These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, please contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Soldering Method Soldering Conditions Recommended Condition Symbol Wave soldering NP82N04MDG, NP82N04NDG Maximum temperature (Solder temperature): 260 °C or below Time: 10 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less THDWS Partial heating NP82N04MDG, NP82N04NDG Maximum temperature (Pin temperature): 350 °C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less P350 Caution Do not use different soldering methods together (except for partial heating). |
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