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ADP5587ACPZ-R7 Datasheet(PDF) 23 Page - Analog Devices

Part No. ADP5587ACPZ-R7
Description  Mobile I/O Expander and QWERTY Keypad Controller
Download  24 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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ADP5587ACPZ-R7 Datasheet(HTML) 23 Page - Analog Devices

 
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ADP5587
Rev. B | Page 23 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD-8.
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.20
2.10 SQ
2.00
Figure 21. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-1)
Dimensions shown in millimeters
A
B
C
D
E
0.645
0.600
0.555
0.230
0.200
0.170
2.010
1.970 SQ
1.930
1
2
3
4
5
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.287
0.267
0.247
SEATING
PLANE
COPLANARITY
0.05
0.40
REF
1.60
REF SQ
0.022
REF
0.395
0.375
0.355
BALL A1
IDENTIFIER
Figure 22. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADP5587ACPZ-R7
−40°C to +85°C
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-24-1
ADP5587ACBZ-R7
−40°C to +85°C
25-Ball Wafer Level Chip Scale Package [WLCSP]
CB-25-4
1
Z = RoHS Compliant Part.


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