Data Sheet

6

Rev. 1.02, 2010-05-20

IFX20001

General Product CharacteristicsFunctional Range

4.2

Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit Remarks

Min.

Max.

4.2.1

Input voltage

V

I

4.0

45

V

IFX20001MBV33

4.2.2

Input Voltage

V

I

5.5

45

V

IFX20001MBV50

4.2.3

Inhibit Voltage

V

INH

-0.3

40

V

4.2.4

Junction temperature

T

j

-40

125

°C–

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.5

Junction to Ambient

R

thJA

–

81

–

K/W

1) Specified

R

(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the package contacted the first inner copper layer.

4.3.1

–

217

–

K/W

2) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow.

Not subject to production test; specified by design.

4.3.2

–

117

–

K/W

heatsink area2)

4.3.3

–

103

–

K/W

heatsink area2)

4.3.4

Junction to Soldering Point

R

thJSP

–

30

–

K/W

Pins 2, 5 fixed to

T

A