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ISL8036A Datasheet(PDF) 6 Page - Intersil Corporation |
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ISL8036A Datasheet(HTML) 6 Page - Intersil Corporation |
6 / 25 page ISL8036, ISL8036A 6 FN6853.1 October 18, 2010 14 SS SS is used to adjust the soft-start time. Connect a capacitor from SS to SGND to adjust the soft- start time (current sharing). CSS should not be larger than 33nF. This capacitor, along with an internal 5µA current source sets the soft-start interval of the converter, tSS. 15 VDD Input supply voltage for the logic. VDD to be at the same potential as VIN +0.3/-0.5V. 20, 21 PGND1 Negative supply for the power stage of Channel 1. 18, 19 LX1 Switching node connection for Channel 1. Connect to one terminal of inductor for VOUT1. 16, 17 2, 3 VIN1, VIN2 Input supply voltage. Connect 22µF ceramic capacitor to power ground per channel. 25 PAD The exposed pad must be connected to the SGND pin for proper electrical performance. Add as much vias as possible for optimal thermal performance. Pin Descriptions (Continued) PIN NUMBER SYMBOL DESCRIPTION C SS μF [] 6.25 t SS s [] ⋅ = (EQ. 1) Ordering Information PART NUMBER (Notes 2, 3) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-free) PKG. DWG. # ISL8036IRZ 80 36IRZ -40 to +85 24 Ld 4x4 QFN L24.4x4D ISL8036IRZ-T (Note 1) 80 36IRZ -40 to +85 24 Ld 4x4 QFN L24.4x4D ISL8036AIRZ 80 36AIRZ -40 to +85 24 Ld 4x4 QFN L24.4x4D ISL8036AIRZ-T (Note 1) 80 36AIRZ -40 to +85 24 Ld 4x4 QFN L24.4x4D NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL8036, ISL8036A. For more information on MSL, please see Technical Brief TB363. |
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