PX1011A-ELG datasheet(3/32 Pages) NXP

Part #	PX1011A-ELG

Description	PCI Express stand-alone X1 PHY

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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3 / 32 page

PX1011A_PX1012A_2

Product data sheet

Rev. 02 — 18 May 2006

3 of 32

Philips Semiconductors

PX1011A/PX1012A

PCI Express stand-alone X1 PHY

4.

Ordering information

5.

Marking

[1]

Industrial temperature range.

Table 2.

Ordering information

Type number

Solder process

Package

Name

Description

Version

PX1011A-EL1

SnPb solder ball

compound

LFBGA81

plastic low proﬁle ﬁne-pitch ball grid array package;

81 balls; body 9

× 9 × 1.05 mm

SOT643-1

PX1011A-EL1/G

Pb-free (SnAgCu

solder ball compound)

LFBGA81

plastic low proﬁle ﬁne-pitch ball grid array package;

81 balls; body 9

× 9 × 1.05 mm

SOT643-1

PX1011AI-EL1/G Pb-free (SnAgCu

solder ball compound)

LFBGA81

plastic low proﬁle ﬁne-pitch ball grid array package;

81 balls; body 9

× 9 × 1.05 mm

SOT643-1

PX1012A-EL1/G

Pb-free (SnAgCu

solder ball compound)

LFBGA81

plastic low proﬁle ﬁne-pitch ball grid array package;

81 balls; body 9

× 9 × 1.05 mm

SOT643-1

PX1012AI-EL1/G Pb-free (SnAgCu

solder ball compound)

LFBGA81

plastic low proﬁle ﬁne-pitch ball grid array package;

81 balls; body 9

× 9 × 1.05 mm

SOT643-1

Table 3.

Leaded package marking

Line

Marking

Description

A

PX1011A-EL1

full basic type number

B

xxxxxxx

diffusion lot number

C

2PNyyww

manufacturing code:

2 = diffusion site

P = assembly site

N = leaded

yy = year code

ww = week code

Table 4.

Lead-free package marking

Line

Marking

Description

A

PX1011A-EL1/G

PX1012A-EL1/G

PX1011AI-EL1/G[1]

PX1012AI-EL1/G[1]

full basic type number

B

xxxxxxx

diffusion lot number

C

2PGyyww

manufacturing code:

2 = diffusion site

P = assembly site

G = lead-free

yy = year code

ww = week code

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