IN = 12V, ILOAD =1A
All Output Voltage Versions
Specifications with standard type face are for T
J = 25˚C, and those with bold type face apply over full Operating Tempera-
ture Range. Unless otherwise specified, V
IN = 12V for the 3.3V, 5V, and Adjustable versions and VIN = 24V for the 12V ver-
sion, and I
LOAD = 100 mA.
FEEDBACK = 8V
For 3.3V, 5.0V, and ADJ Versions
FEEDBACK = 15V
For 12V Versions
ON/OFF Pin = 0V
Output Leakage Current
IN = 40V, ON/OFF Pin = 0V
SWITCH = −1V, ON/OFF Pin = 0V
SWITCH = 1A
Measured at Switch Pin
Maximum Duty Cycle
Minimum Duty Cycle
FEEDBACK = 1.3V
ADJ Version Only
ON/OFF Pin Current
ON/OFF Pin = 0V
N Package, Junction to Ambient (Note 9)
M Package, Junction to Ambient (Note 9)
Note 4: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see
the Electrical Characteristics.
Note 5: The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
Note 6: External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator
performance. When the LM2675EP is used as shown in Figures 2, 3 test circuits, system performance will be as specified by the system parameters section of the
Note 7: Typical numbers are at 25˚C and represent the most likely norm.
Note 8: All limits guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
Note 9: Junction to ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional copper area will
lower thermal resistance further. See Application Information section in the application note accompanying this datasheet and the thermal model in LM267X Made
Simple software (version 6.0). The value
θJ−A for the LLP (LD) package is specifically dependent on PCB trace area, trace material, and the number of layers and
thermal vias. For improved thermal resistance and power dissipation for the LLP package, refer to Application Note AN-1187.