9

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FN6867.1

June 12, 2009

ISL9021

Wafer Level Chip Scale Package

(WLCSP 0.4mm Ball Pitch)

SIDE VIEW

TOP VIEW

BOTTOM VIEW

PIN 1

E

D

A2

b

A1

e ( E1 )

SE

e ( D1 )

2

b

A

B

SD

A

1

W2x2.4

2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE

SYMBOL

MILLIMETERS

A

0.44 Min, 0.495 Nom, 0.55 Max

A1

0.190 ±0.030

A2

0.305 ±0.025

b

0.270 ±0.030

D

1.155 ±0.020

D1

0.400 BASIC

E

0.975 ±0.020

E1

0.400 BASIC

e

0.400 BASIC

SD

0.200 BASIC

SE

0.00 BASIC

NUMBER OF BUMPS: 4

Rev. 2 6/08

NOTES:

1. All dimensions are in millimeters.