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ISL8104EVAL2Z Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL8104EVAL2Z Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 14 page 4 FN9257.0 February 13, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage, VPVCC,VVCC . . . . . . . . . . . . . . GND - 0.3V to +16V Enable Voltage, VEN . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to +16V Soft-start Done Voltage, VSSDONE . . . . . . . . . . GND - 0.3V to +16V Boot Voltage, VBOOT. . . . . . . . . . . . . . . . . . . . . GND - 0.3V to +36V Phase Voltage, VPHASE . . . . . . . . . VBOOT - 16V to VBOOT + 0.3V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 5.0V Operating Conditions Supply Voltage, VVCC . . . . . . . . . . . . . . . . .+8V ±5% to +14V ±10% Supply Voltage, VPVCC . . . . . . . . . . . . . . . .+8V ±5% to +14V ±10% Boot to Phase Voltage, VBOOT - VPHASE . . . . . . . . . . . . . . <VPVCC Ambient Temperature Range, ISL8104C . . . . . . . . . . . . 0°C to 70°C Ambient Temperature Range, ISL8104I. . . . . . . . . . . .-40°C to 85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) SOIC Package (Note 1) . . . . . . . . . . . . 95 N/A QFN Package (Note 2). . . . . . . . . . . . . 47 8.5 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (SOIC - Lead tips only) ESD Ratings ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 3. Parameters designated by GBD are "Guaranteed by Design." Electrical Specifications Recommended Operating Conditions, unless otherwise noted specifications in bold are valid for process, temperature, and line operating conditions. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS VCC SUPPLY CURRENT Shutdown Supply VCC IVCC SS/EN = 0V 3.5 6.1 8.5 mA Shutdown Supply VPVCC IPVCC SS/EN = 0V 0.30 0.5 0.75 mA POWER-ON RESET VCC/VPVCC Rising Threshold 6.55 7.10 7.55 V VCC/VPVCC Hysteresis 170 250 500 mV OCSET Rising Threshold 0.70 0.73 0.75 V OCSET Hysteresis 180 200 220 mV Enable - Rising Threshold 1.4 1.5 1.60 V Enable - Hysteresis 175 250 325 mV OSCILLATOR Trim Test Frequency RRT = OPEN VVCC = 12 175 200 220 kHz Total Variation 8k Ω < RRT to GND < 200kΩ - GBD - ±15 - % Ramp Amplitude ∆VOSC RRT = OPEN 1.7 1.9 2.15 VP-P ERROR AMPLIFIER DC Gain RL = 10kΩ, CL= 100pF - GBD - 88 - dB Gain-Bandwidth Product GBWP RL = 10kΩ, CL= 100pF - GBD - 15 - MHz Slew Rate SR RL = 10kΩ, CL= 100pF - GBD - 6 - V/ µs PROTECTION OCSET Current IOCSET TJ = 0°C to 70°C 180 200 220 µA OCSET Current IOCSET TJ = -40°C to 85°C 176 200 224 µA OCSET Measurement Offset OCPOFFSET OCSET= 1.5V to 15.4V - GBD - ±10 - mV Soft-start Current ISS 22 30 38 µA ISL8104 |
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