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ISL97636IRZ Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL97636IRZ Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 18 page 4 FN6570.0 May 9, 2008 Absolute Maximum Ratings (TA = +25°C) Thermal Information VIN, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 24V VDC, COMP, RSET, EN/PWM . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V OVP, IIN0 - IIN7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V LX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V PGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V Above voltage ratings are all with respect to GND pin Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Thermal Resistance (Typical, Notes 1, 2) θ JA (°C/W) θ JC (°C/W) 24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . 39 2 Thermal Characterization (Typical, Note 3) PSIJT (°C/W) 24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ~0.7 Maximum Continuous Junction Temperature . . . . . . . . . . . . +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 1. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 2. For θ JC, the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case temperature. 3. PSIJT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die junction temperature can be estimated more accurately than the θ JC and θJC thermal resistance ratings. 4. Limits established by characterization and are not production tested. Electrical Specifications All specifications below are tested at TA = -40°C to +85°C; VIN = 12V, EN = 5V, RSET = 36.6kΩ; Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT GENERAL VIN Backlight Supply Voltage ≤ 9 LEDs per channel (3.5V/30mA type) 624 V IVIN_STBY VIN Shutdown Current 5µA VOUT Output Voltage 34.5 V Vuvlo Undervoltage Lockout Threshold 2.45 2.8 V Vuvlo_hys Undervoltage Lockout Hysteresis 300 mV SS Soft-start 1ms PWM GENERATOR EN/PWM EN/PWM Voltage Range 2.7 5.5 V ENmin Minimum Enable Signal 40 µs tMAX_PWM_OFF Maximum PWMI Off Time Before Shutdown EN/PWMI toggles 28 ms REGULATOR VDC LDO Output Voltage VIN > 6V 5.0 5.5 V IVDC_STBY Standby Current EN/PWM = 0V 20 µA IVDC Active Current EN/PWM = 5V 10 mA VLDO VDC LDO Dropout Voltage VIN > 5.5V, 30mA 30 200 mV BOOST SWILimit Boost FET Current Limit TA = +25°C 2.3 3.2 A TA = -40°C, +85°C 2.2 A rDS(ON) Internal Boost Switch ON-Resistance 130 260 m Ω ISL97636 |
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