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ISL97636IRZ Datasheet(PDF) 4 Page - Intersil Corporation

Part # ISL97636IRZ
Description  8-Channel LED Driver
Download  18 Pages
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL97636IRZ Datasheet(HTML) 4 Page - Intersil Corporation

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4
FN6570.0
May 9, 2008
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VIN, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 24V
VDC, COMP, RSET, EN/PWM . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
OVP, IIN0 - IIN7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
LX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V
PGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to GND pin
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Notes 1, 2)
θ
JA (°C/W)
θ
JC (°C/W)
24 Ld QFN . . . . . . . . . . . . . . . . . . . . . .
39
2
Thermal Characterization (Typical, Note 3)
PSIJT (°C/W)
24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
~0.7
Maximum Continuous Junction Temperature . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For
θ
JC, the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case temperature.
3. PSIJT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die junction temperature
can be estimated more accurately than the
θ
JC and θJC thermal resistance ratings.
4. Limits established by characterization and are not production tested.
Electrical Specifications
All specifications below are tested at TA = -40°C to +85°C; VIN = 12V, EN = 5V, RSET = 36.6kΩ; Parameters
with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits
established by characterization and are not production tested.
PARAMETER
DESCRIPTION
CONDITION
MIN
TYP
MAX
UNIT
GENERAL
VIN
Backlight Supply Voltage
≤ 9 LEDs per channel
(3.5V/30mA type)
624
V
IVIN_STBY
VIN Shutdown Current
5µA
VOUT
Output Voltage
34.5
V
Vuvlo
Undervoltage Lockout Threshold
2.45
2.8
V
Vuvlo_hys
Undervoltage Lockout Hysteresis
300
mV
SS
Soft-start
1ms
PWM GENERATOR
EN/PWM
EN/PWM Voltage Range
2.7
5.5
V
ENmin
Minimum Enable Signal
40
µs
tMAX_PWM_OFF
Maximum PWMI Off Time Before
Shutdown
EN/PWMI toggles
28
ms
REGULATOR
VDC
LDO Output Voltage
VIN > 6V
5.0
5.5
V
IVDC_STBY
Standby Current
EN/PWM = 0V
20
µA
IVDC
Active Current
EN/PWM = 5V
10
mA
VLDO
VDC LDO Dropout Voltage
VIN > 5.5V, 30mA
30
200
mV
BOOST
SWILimit
Boost FET Current Limit
TA = +25°C
2.3
3.2
A
TA = -40°C, +85°C
2.2
A
rDS(ON)
Internal Boost Switch ON-Resistance
130
260
m
Ω
ISL97636


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