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APX803-26SA Datasheet(PDF) 4 Page - Diodes Incorporated

Part No. APX803-26SA
Description  er3-PIN MICROPROCESSOR RESET CIRCUIT
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Maker  DIODES [Diodes Incorporated]
Homepage  http://www.diodes.com
Logo DIODES - Diodes Incorporated

APX803-26SA Datasheet(HTML) 4 Page - Diodes Incorporated

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APX803/D
3-PIN MICROPROCESSOR RESET CIRCUIT
APX803
Document number: DS32132 Rev. 2 - 2
4 of 11
www.diodes.com
September 2010
© Diodes Incorporated
Electrical Characteristics (TA = 25°C)
TA= -40 to 85
°C unless otherwise note. Typical values are at TA=+25 °C.
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
ICC
Supply Current
VTH + 0.2V
30
40
μA
VTH
Reset Threshold
APX803-23
TA = 25
oC
2.21
2.25
2.30
V
APX803-26
2.59
2.63
2.66
APX803-29
2.89
2.93
2.96
APX803D-29
2.89
2.93
2.96
APX803-31
3.04
3.08
3.13
APX803-40
3.94
4.00
4.06
APX803-44
4.31
4.38
4.45
APX803-46
4.56
4.63
4.70
Reset Threshold hysteresis
VTH-H – VTH-L
40
mV
Reset Threshold Tempco
30
ppm/°C
tS
VCC to RESET delay
VCC = VTH to (VTH – 100mV)
20
µs
tDELAY
Reset Active
Timeout Period
APX803-XX
TA = 0
oC to +85oC
140
200
280
ms
APX803D-29
1
3.3
VOL
T
RESE Output Voltage Low
VCC = VTH -0.2, ISINK = 1.2mA
0.3
V
VCC = VTH -0.2, ISINK = 3.5mA
0.4
VCC > 1.0V, ISINK = 50uA
0.3
IOH
T
RESE
Output High leakage
current
VCC > VTH +0.2
1
µA
θJA
Thermal Resistance Junction-to-
Ambient
SOT23/SOT23R (Note 2)
201
°C/W
θJC
Thermal Resistance
Junction-to-Case
SOT23/SOT23R (Note 2)
56
°C/W
Notes:
2. Test condition for SOT23 and SOT23R: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum
recommended pad layout.
3. Final datasheet limits to be determined by characterization and correlation.


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