HAF2026RJ

Preliminary

R07DS0122EJ0300 Rev.3.00

Page 6 of 7

Sep 01, 2010

10

μ

100

μ

1 m

10 m

100 m

1

10

Pulse Width PW (S)

Normalized Transient Thermal Impedance vs. Pulse Width (1 Drive Operation)

100

1000

10000

10

1

0.1

0.01

0.001

0.0001

D = 1

0.5

0.2

0.1

0.05

0.02

0.01

1shot

pulse

DM

P

PW

T

D =

PW

T

θch-f(t) = γs (t) • θch - f

θch-f = 125°C/W, Ta = 25°C

When using the glass epoxy board

(FR4 40 x 40 x 1.6 mm)

10

μ

100

μ

1 m

10 m

100 m

1

10

Pulse Width PW (S)

Normalized Transient Thermal Impedance vs. Pulse Width (2 Drive Operation)

100

1000

10000

10

1

0.1

0.01

0.001

0.0001

D = 1

0.5

0.2

0.1

0.05

0.02

0.01

1shot

pulse

DM

P

PW

T

D =

PW

T

θch-f(t) = γs (t) • θch - f

θch-f = 166°C/W, Ta = 25°C

When using the glass epoxy board

(FR4 40 x 40 x 1.6 mm)

Vin Monitor

D.U.T.

Vin

5 V

= 30 V

tr

td(on)

Vin

90%

90%

10%

10%

Vout

td(off)

Vout

Monitor

50

Ω

90%

10%

tf

Switching Time Test Circuit

Switching Time Waveform