88

Revised: May 10, 2010

©2010 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

SPA™ Silicon Protection Array Products

Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection

SP3011 Lead-Free/Green Series

Reflow Condition

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

Do not exceed

260°C

Soldering Parameters

Application Example

Signal GND

USB Controller

USB Port

Outside

World

SSTX+

SSTX-

SSRX+

SSRX-

GND

D+

D-

SP3011-06UTG

IC