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SP3003 Datasheet(PDF) 6 Page - Littelfuse

Part No. SP3003
Description  Low Capacitance ESD Protection Array
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Manufacturer  LITTELFUSE [Littelfuse]
Direct Link  http://www.littelfuse.com
Logo LITTELFUSE - Littelfuse

SP3003 Datasheet(HTML) 6 Page - Littelfuse

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70
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
SP3003 Lead-Free/Green Series
Product Characteristics
Lead Plating
Matte Tin (SC70-x, MSOP-10),
Pre-Plated Frame (SOT5x3)
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Part Numbering System
Part Marking System
SP3003-04 XTG
Silicon
Protection
Array
Series
Number of Channels
-02 = 2 channel
(SC70-5, SOT553 packages)
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
Package
A = MSOP-10, 3000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
T= Tape & Reel
G= Green
XXX
X X X
Product Series
(varies) F, H or P =
SP3003 series Assembly Site
(varies)
Number of Channels
(varies) 2 or 4
Package Dimensions — SOT563
T
O
S
e
g
a
k
c
a
P
563
6
s
n
i
P
Millimeters
Inches
Min
Max
Min
Max
A
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
e
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
c
HE
L
A
D
6
4
2
3
E
e
B
5
Solder Pad Layout
Package Dimensions — MSOP10
0
1
P
O
S
M
e
g
a
k
c
a
P
0
1
s
n
i
P
Millimeters
Inches
Min
Max
Min
Max
A
-
1.10
-
0.043
A1
0.00
0.15
0.000
0.006
B
0.17
0.27
0.007
0.011
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.67
5.10
0.184
0.200
E1
2.90
3.10
0.114
0.122
e
0.50 BSC
0.020 BSC
HE
0.40
0.80
0.016
0.031
Solder Pad Layout


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