43

©2010 Littelfuse, Inc.

Revised: February 9, 2010

SPA™ Silicon Protection Array Products

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Low Capacitance ESD Protection Array

SP3001 Lead-Free/Green Series

Package Dimensions - SC70-6

Package

SC70-6

Pins

6

JEDEC

MO-203 Issue A

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.10

0.031

0.043

A1

0.00

0.10

0.000

0.004

A2

1.00

0.028

0.039

B

0.15

0.30

0.006

0.012

c

0.08

0.25

0.003

0.010

D

1.85

2.25

0.089

E

1.15

1.35

0.045

0.053

e

0.65 BSC

0.026 BSC

HE

2.00

2.40

0.094

L

0.26

0.46

0.010

0.018

D

A2 A

A1

C

L

E

HE

2

1

3

6

5

4

e

e

B

Part Numbering System

Product Characteristics

Ordering Information

Part Number

Package

Marking

Min. Order Qty.

SP3001-04JTG

3000

Lead Plating

Matte Tin

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

Part Marking System

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

SP3001-04 J T G

Silicon

Protection

Array

Series

Number of Channels

-04 = 4 channel

Package

J = SC70-6, 3000 quantity

T= Tape & Reel

G= Green

Product Series

D = SP3001 series

Assembly Site

(varies)

Number of Channels

Solder Pad Layout