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OPA209 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA209 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 25 page  OPA209 OPA2209 OPA4209 SBOS426B – NOVEMBER 2008 – REVISED AUGUST 2010 www.ti.com ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued) Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to midsupply, and VCM = VOUT = midsupply, unless otherwise noted. OPA209, OPA2209, OPA4209 PARAMETER CONDITIONS MIN TYP MAX UNIT OUTPUT Voltage Output Swing RL = 10kΩ, AOL > 130dB (V–) + 0.2V (V+) – 0.2V V RL = 600Ω, AOL > 114dB (V–) + 0.6V (V+) – 0.6V V over Temperature RL = 10kΩ, AOL > 120dB (V–) + 0.2V (V+) – 0.2V V Short-Circuit Current ISC VS = ±18V ±65 mA Capacitive Load Drive (stable operation) CLOAD See Typical Characteristics Open-Loop Output Impedance ZO See Typical Characteristics POWER SUPPLY Specified Voltage VS ±2.25 ±18 V Quiescent Current (per amplifier) IQ IO = 0A 2.2 2.5 mA over Temperature 3.25 mA TEMPERATURE RANGE Specified Range TA –40 +125 °C Operating Range TA –55 +150 °C THERMAL INFORMATION OPA209AID OPA209AIDBV OPA209AIDGK THERMAL METRIC(1) D DBV DGK UNITS 8 5 8 qJA Junction-to-ambient thermal resistance(2) 135.5 204.9 142.6 qJCtop Junction-to-case (top) thermal resistance 73.7 200 46.9 qJB Junction-to-board thermal resistance 61.9 113.1 63.5 °C/W yJT Junction-to-top characterization parameter 19.7 38.2 5.3 yJB Junction-to-board characterization parameter 54.8 104.9 62.8 qJCbot Junction-to-case (bottom) thermal resistance n/a n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. THERMAL INFORMATION OPA2209AID OPA2209AIDGK OPA4209AIPW THERMAL METRIC(1) D DGK PW UNITS 8 8 14 qJA Junction-to-ambient thermal resistance(2) 134.3 132.7 112.9 qJCtop Junction-to-case (top) thermal resistance 72.1 38.5 26.1 qJB Junction-to-board thermal resistance 60.7 52.1 61.0 °C/W yJT Junction-to-top characterization parameter 18.2 2.4 0.7 yJB Junction-to-board characterization parameter 53.8 52.8 59.2 qJCbot Junction-to-case (bottom) thermal resistance n/a n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. 4 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): OPA209 OPA2209 OPA4209 |
Similar Part No. - OPA209_10 |
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